DX-4180 is a single component, heat cured epoxy resin adhesive. Used for bonding SMD components on printed circuit boards, its fast curing characteristics make it particularly suitable for SMT production requirements. Its very low moisture absorption allows the adhesive to be exposed to air for a long time without affecting its dispersion or the formation of voids after curing.
Main features:
| Appearance |
Red paste |
| Type |
Epoxy resin |
| Curing |
Heating solidification |
| Application |
Adhesive for surface mounting and small component bonding |
| Dispersion method |
Steel mesh printing |
Performance before curing:
| Specific gravity (25 ℃, g/cm) |
1.3 |
Specific gravity cup |
| Viscosity(1rpm 25℃)，CP |
1,250，000 |
Brookfield DV-Ⅱ viscometer，25℃,SC 4-15/1rpm |
| Thixotropic index |
5.7 |
1rpm/10rpm |
| Flash point（TCC） |
see SDS |
Curing conditions:
The suitable curing conditions are generally heating at 150 ℃ for 90-120 seconds. The relationship between curing speed and final adhesive strength and curing time under this curing temperature condition is shown in the following figure.
In the actual production process, the entire heating time is longer than the time indicated in the figure, because there is a period of preheating time.
| Density（25℃，g/cm³） |
1.3 |
ASTM D1875 |
| Thermal expansion coefficient um/m/℃ |
70 |
ASTM D3386 |
| Glass transition temperature ℃ |
110 |
DSC |
| shear strength(Stainless Steel/Stainless Steel) MPa |
18 |
GB 7124-2008 |
| Pull strength N |
63 |
C-1206,FR4 Bare wire board |
| dielectric constant |
3.8（100KHz） |
ASTM D150 |
| Dielectric tangent |
0.014(100KHz |
ASTM D150 |
| Volume resistivity Ω.CM |
2.1*1015 |
ASTM D257 |
| Surface Resistivity Ω |
2.1*1015 |
ASTM D257 |
Use explanation:
Refrigerated storage must be reheated before use, and 200g per pack requires 4 hours (25 ℃)
Precautions:
(1) To avoid contaminating unused glue, do not pour any glue back into the original packaging.
(2) Bare placement of glue in the air can absorb trace amounts of moisture and affect its performance, so it should be avoided as much as possible. When printing on steel mesh, do not leave the printed circuit board with red glue in the air for too long. It should be fixed as soon as possible, and if possible, the air humidity should be controlled.
Storage:
-At a temperature of 15-0 ℃, in a dry place, the shelf life is 6 months.
Packaging specifications:
200g, 360g or provide packaging according to customer needs.
Explanation: The above data is based on our extensive experiments and the results are reliable. However, due to the diversity of practical applications, the application conditions are beyond our control, so users need to conduct tests before use to confirm whether this product is suitable. Our company does not guarantee any problems that may arise from the use of our products under specific conditions, and we do not assume any responsibility for direct, indirect, or accidental losses. If users encounter any problems during use, they can contact our technical service department, and we will do our best to provide you with as much assistance as possible.
