1. Product Introduction and Usage
DX-23006 epoxy thermosetting adhesive is a single component, fast curing modified epoxy adhesive designed as a repairable bottom filling adhesive for CSP (FBGA) and BGA. It can form a consistent and defect free bottom filling layer, effectively reducing the damage to the chip caused by thermal expansion coefficient mismatch between the chip and substrate or external forces, and improving the reliability of the product.
2. Material Durability Before Curing
| Appearance |
Milky white paste |
| proportion(25℃，g/cm) |
1.1 |
| Viscosity(25℃ Bnookfeild),cps |
5200±10% |
| Thixotropic index |
3.3 |
| Flash point (℃) |
＞100 |
| Usage time @25℃,hours |
48 |
3. Storage Conditions
At a temperature of 2-8 ℃, in a cool and dry place, it can be stored for 3 months.
4. Curing conditions
Recommended curing conditions
80 ℃ for 40 minutes
Note: For all rapid curing systems, the required curing time depends on the heating rate, which in turn depends on the weight of the material to be heated and the contact method with the heat source; The recommended curing conditions are for general reference only, other curing conditions may yield better results.
5. Material properties and characteristics after curing
| Density（25℃，g/cm） |
1.1 |
Thermal expansion coefficientum/m/℃
ASTM E831-86 |
1:＜Tg 50 |
| thermal conductivityASTM C177，W.M-1.K-1 |
0.2 |
| Water absorption rate（24hrs in water@25℃）,% |
0.16 |
| Glass transition temperature Tg (℃) |
110 |
| Fracture elongation% |
3.6 |
| Tensile strength at break N/mm2(psi) |
56（8，120） |
| Tensile modulus N/mm2(psi) |
2，200（319，100） |
| Hardness after curing |
83D |
| dielectric constant |
3.6（100KHz） |
| Environmental standards |
conform toROHS/HF/REACH |
| Dielectric tangent |
0.016(100KHz) |
| Volume resistivityASTM D257 ,Ω.cm |
4.4*10 |
| Surface ResistivityASTM D257, Ω |
1.1*10 |
| Surface insulation resistance, Ω |
initial |
52*10 |
| After aging（85℃,85%RH,96hrs,5 DCV） |
8.1*10 |
shear strength
（60minutes@100℃） |
Steel (sandblasted)，N/mm(psi) |
≥8(1,160) |
| Epoxy fiberglass reinforced plastic,N/mm(psi) |
10（1,450） |
6. Packaging
Packaging method: 30ml per unit, net weight: 33g ± 1, or as specified by the customer
7. Usage and Precautions
Processing information:
1、 During transportation, all transport boxes must be equipped with cold ice bags to maintain a temperature below 8 ℃;
2、 DX-23006 stored in refrigeration must be reheated before use, and a 30ml syringe requires 1-2 hours (the actual required time may vary depending on the size/volume of the packaging); Do not loosen the mouth, lid, or cap of the packaging container; The packaging of the syringe tube must be placed with the mouth facing downwards; Do not thaw by heating, as it may cause partial solidification of the adhesive;
3、 To avoid contaminating unused glue, do not pour any glue back into the original packaging.
Usage guide:
Install the product onto the gluing equipment. Many types of gluing equipment are suitable, including manual gluing machines/time pressure valves, spiral valves, linear piston pumps, and injection valves. The selection of equipment should be based on the requirements of use.
1、 Ensure that no air is introduced into the product during the device setup period;
2、 Apply glue at a suitable speed (2.5-12.7mm/s), ensuring that the distance between the needle tip and the edges of the substrate and chip is 0.025-0.076mm, which ensures optimal flow of the bottom filling glue;
3、 The method of applying glue is generally "I" - shaped along one edge or "L" - shaped along two edges intersecting at the corner. The starting point of adhesive application should be as far away from the center of the chip as possible to ensure that there are no voids in the filling of the chip. When applying glue, the length of each glue in the "I" or "L" shape should not exceed 80% of the chip;
4、 In some cases, a second or third application of glue may be necessary on the product.
explain:
The information mentioned in this technical parameter, including recommendations for product use and application, is based on our company's knowledge and experience related to the product at the time of producing this technical parameter. We are not responsible for any results obtained by anyone using methods beyond our control. It is the user's responsibility to apply this product to the production methods mentioned in this technical specification and take the measures mentioned in this article to prevent possible losses and personal injuries during storage and use of the product. The product may have multiple uses and may change due to changes in usage and operating conditions beyond our control. Therefore, Dingxin New Materials is not responsible for whether the product is suitable for your company's production process, production conditions, expected use, and structure. We strongly recommend that your company conduct testing before producing the product to determine its suitability.
Unless otherwise expressly agreed, our company shall not be liable for the information in this technical specification or any other oral or written suggestions related to the product in question. The liability for personal injury or death caused by our company's negligence and the mandatory rules of the applicable product liability law shall not be included.
