1. Product Introduction and Usage
Dingxin 4183 patch red adhesive is a single component, high-temperature and fast curing epoxy adhesive used for bonding SMD components on printed circuit boards. Dingxin 4183 has excellent thixotropy and is particularly suitable for manual steel mesh and thick plate printing.
2. Material Durability Before Curing
| Project |
Typical parameters |
| Appearance |
Red gel adhesive |
| Yield value (25 ℃, pa） |
620 |
| proportion（25℃，g/cm） |
1.2±0.1 |
| Viscosity（25℃，cps） |
36万±10% |
| Thixotropic index |
6.2~6.8 |
| Flash point（TCC） |
＞95℃ |
| Particle size |
≤15um |
| Copper mirror corrosion |
No corrosion |
3. Storage Conditions
It can be stored for 6 months in a cool and dry place at a temperature of 2-8 ℃.
4. Usage and Precautions
The stored Dingxin 4183 must be warmed before use. At a temperature of 25 ℃, the standard temperature for 30ml is 2-4 hours, while the temperature for 200-300ml is 4-6 hours.
Attention:
(1) To avoid contaminating unused glue, do not pour any glue back into the original packaging.
(2) Bare placement of glue in the air can absorb trace amounts of moisture and affect its performance, so it should be avoided as much as possible. When printing on steel mesh, do not leave the printed circuit board with red glue in the air for too long. It should be fixed as soon as possible, and if possible, the air humidity should be controlled.
(3) If it is in a non-standard conventional environment (25 ℃), please thaw it completely according to the specific environment, and do not thaw the glue quickly by heating.
5. Curing conditions
The recommended solidification curve is shown in the following figure:
The suitable curing conditions are generally heating at 150 ℃ for 120-150 seconds. The relationship between curing speed and final adhesive strength and curing temperature and time is shown in the following figure:
In the actual production process, the entire heating time is longer than indicated in the figure because there is a preheating time.
6. Material Properties and Characteristics after Curing
| Project |
Typical parameters |
| Density（25℃，g/cm） |
1.12±0.1 |
Thermal expansion coefficient（um/m/℃）
ASTM E831-86 |
a1：＜tg50 |
| a2：＜tg160 |
| thermal conductivity ASTM C177，W.M-1.K-1 |
0.25 |
| specific heat KJ.Kg-1.K-1 |
0.3 |
| Glass transition temperature (℃) |
112 |
| dielectric constant |
3.8（100KHz） |
| Dielectric tangent |
0.014（100KHz） |
| Volume resistivityASTM D257 |
2.1*10Ω.CM |
| Surface ResistivityASTM D257 |
2.1*10Ω.CM |
| Electrochemical corrosionDIN 53489 |
AN-1.2 |
| shear strength(Sandblasting low-carbon steel sheet)N/mm ASTMD1002 |
26 |
| Pull off strength N (C-1206, FR4 bare circuit board) |
63 |
| Torque strength N.mm (C-1206, FR4 exposed circuit board) |
51 |
7. Environmental resistance performance
Test method: ISO 4587/ASTM D1002 sheet strength
Test material: GBMS shear test piece
Curing method: Cure at 150 ℃ for 30 minutes
Thermal intensity
Eighth, Chemical/Solvent Resistance
Aging at the specified temperature and testing at 22 ℃
| / |
Initial strength residual rate% |
| Conditions |
Temperature |
100hr |
500hr |
1000hr |
| Air quality |
22℃ |
100 |
100 |
100 |
| Air quality |
150℃ |
95 |
95 |
93 |
| 98%RH |
40℃ |
88 |
76 |
74 |
| Terpenes |
22℃ |
100 |
100 |
100 |
9. Immersion of heat-resistant solder
According to IPC SM817 (2.4.421) standard, product DX4181 has passed the hot solder immersion test. Place the C-1206 capacitor bonded to FR4PCB using DX4181 on top of a solder pot at a temperature of 260 ℃ for 60 seconds, then immerse it in the pot for 10 seconds without any component detachment or displacement.
explain:
The information mentioned in the technical parameters, including recommendations for product use and application, is based on our company's knowledge and experience related to the product at the time of producing these technical parameters. We are not responsible for any results obtained by anyone using methods beyond our control. It is the user's responsibility to apply this product to the production methods mentioned in this technical specification and take the measures mentioned in this article to prevent possible losses and personal injuries during storage and use of the product. The product may have multiple uses and may change due to changes in usage and operating conditions beyond our control. Therefore, Dingxin Technology is not responsible for whether the product is suitable for the production process, production conditions, expected use, and structure used by your company. We strongly recommend that your company conduct testing before producing the product to determine its suitability.
Unless otherwise expressly agreed, our company shall not be liable for the information in this technical specification or any other oral or written suggestions related to the product in question. The liability for personal injury or death caused by our company's negligence and the mandatory rules of the applicable product liability law shall not be included.
If the product is judged by Dingxin Technology to be liable, regardless of any legal basis, Dingxin Technology's liability shall not exceed the value of the delivered product itself.
