1. Product Introduction and Usage
Surface mount red adhesive DX-4182 is a single component, high-temperature fast curing epoxy adhesive designed specifically for SMT bonding. It has excellent thixotropy and is suitable for high-speed SMT surface mount machine dispensing. High adhesive strength after curing.
Red Glue DX-4182 is a carefully developed adhesive for various original device patches by our company. It is tested with glass diodes, transistors, and M7s, and has an average thrust of about 3KG. It is only introduced to the market with certain quality assurance, and has certain advantages in price and quality.
2. Material Durability Before Curing
| Project |
Typical parameters |
| Appearance |
Red gel adhesive |
| Yield value (25 ℃, pa） |
600 |
| proportion（25℃，g/cm） |
1.2 |
| Viscosity（25℃，cps） |
7.5-8.5（万） |
| Thixotropic index |
6.5-7.5 |
| Flash point（TCC） |
＞90℃ |
| Particle size |
15um |
| Copper mirror corrosion |
No corrosion |
3. Storage Conditions
Storage conditions: At a temperature of 2-8 ℃, in a cool and dry place, it can be stored for 3 months.
4. Usage and Precautions
The red glue DX-4182 stored in refrigeration must be reheated before use. A 30mL syringe takes 1 hour, and a 200G/360G container takes 2 hours.
Attention:
(1) To avoid contaminating unused glue, do not pour any glue back into the original packaging.
(2) Bare placement of glue in the air can absorb trace amounts of moisture and affect its performance, so it should be avoided as much as possible. When printing on steel mesh, do not leave the printed circuit board with red glue in the air for too long. It should be fixed as soon as possible, and if possible, the air humidity should be controlled.
5. Curing conditions
The suitable curing conditions are generally heating at 150 ℃ for 4 minutes. The curing speed and final bonding strength are related to the curing temperature and time as follows
Example: Eight temperature zone reflow soldering schematic table
| 1-2 temperature zone |
3-4 temperature zone |
5-6 temperature range- |
7-8 temperature range |
| 120-140℃ |
150℃-160 |
185℃-190 |
150℃--110 |
| The whole process takes about 3 and a half to 5 minutes |
In the actual production process, the entire heating time is longer than indicated in the figure because there is a preheating time.
Attachment: Usage process and method of red glue
First, place the PCB board - manually or machine glue - paste the parts - QC visual inspection and calibration - reflow soldering [curing temperature 150 degrees curing time (constant temperature) 3.5 minutes] - QC visual inspection [missing parts situation]. According to the individual production situation of the customer, whether to produce the plug-in through tin furnace or wave soldering in the future.
6. Material Properties and Characteristics after Curing
| Project |
Typical parameters |
| Density（25℃，g/cm） |
1.2 |
Thermal expansion coefficient（um/m/℃）
ASTM E831-86 |
25℃-70℃51 |
| 90℃-150℃160 |
| thermal conductivity ASTM C177，W.M-1.K-1 |
0.26 |
| specific heat KJ.Kg-1.K-1 |
0.3 |
| Glass transition temperature (℃) |
105 |
| dielectric constant |
3.8（100KHz） |
| Dielectric tangent |
0.014（100KHz） |
| Volume resistivityASTM D257 |
2*10Ω.CM |
| Surface ResistivityASTM D257 |
2*10Ω. |
| Electrochemical corrosionDIN 53489 |
AN-1.2 |
| shear strength(Sandblasting low-carbon steel sheet)N/mm ASTMD1002 |
24 |
| Pull off strength N (C-1206, FR4 bare circuit board) |
61 |
| Torque strength N.mm (C-1206, FR4 exposed circuit board) |
52 |
7. Environmental resistance performance
Test method: ISO 4587/ASTM D1002hear strength
Test material: GBMS shear test piece
Curing method: Cure at 150 ℃ for 4 minutes
Thermal intensity
8. Chemical/Solvent Resistance
Aging at the specified temperature and testing at 22 ℃
Initial strength residual rate%
| / |
Initial strength residual rate% |
| Conditions |
Temperature |
100hr |
500hr |
1000hr |
| Air quality |
22℃ |
100 |
100 |
100 |
| Air quality |
150℃ |
95 |
95 |
90 |
| 98%RH |
40℃ |
90 |
80 |
75 |
| Terpenes |
22℃ |
100 |
100 |
100 |
9. Immersion of heat-resistant solder
According to IPC SM817 (2.4.421) standard, the product DX-4182 has passed the hot solder immersion test. Will use red glue
The C-1206 capacitor bonded to FR4PCB with DX-5012 is placed above a solder pot at a temperature of 280 ℃ for 60 seconds, and then immersed in the pot for 10 seconds. There is no detachment or displacement of any components.
10. Packaging Form
Packaging form: 30ml/200g/360g
Shelf life: 3 months
